Edgetek™ 3D/LDS Solutions
Multi-Function Integration, Miniaturization
Edgetek 3D/LDS solutions are advanced technologies to help customers to build 3D circuits on molded part surfaces, which are widely used for consumer electronics, automotive components, medical devices, and 5G base stations.
Available in PC, PPS and LCP formulations, the materials can be customized for customers’ specific needs. They offer high design flexibility, multi-function integration, size miniaturization and weight reduction to meet demanding manufacturing requirements without compromising production efficiency and cost.
These 3D/LDS Edgetek formulations also can assist advanced electronic component manufacturers to miniaturize mechanical and electrical systems for smaller end products, even in high heat manufacturing process, such as SMT.
Combining function and performance, this technology provides ample opportunity to support the exponential growth of 5G technology, including the construction of infrastructure and related future applications.
Impact
- Increased design flexibility
- Integration of various functionalities
- Miniaturization and weight reduction
- Reduced initial part cost and production cost
- Simplified processes
- Shorter assembly time
- Commercially available in Asia
Resources
Marketing + Technical Info
Browse and download our literature to learn more about Avient solutions and services.
Technical Data Sheets
Browse our library of product data sheets containing technical descriptions and details.
Safety Data Sheets
Important information about the health, safety and environmental impacts of Avient products.
